119-hr5287

[Congressional Bills 119th Congress]
[From the U.S. Government Publishing Office]
[H.R. 5287 Introduced in House

    (IH) ]

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119th CONGRESS
 1st Session
 H. R. 5287

To require an annual report on the advanced semiconductor manufacturing 
 capabilities of the People's Republic of China.

_______________________________________________________________________

 IN THE HOUSE OF REPRESENTATIVES

 September 10, 2025

Mr. Vindman (for himself and Mr. Moylan) introduced the following bill; 
 which was referred to the Committee on Foreign Affairs

_______________________________________________________________________

 A BILL

To require an annual report on the advanced semiconductor manufacturing 
 capabilities of the People's Republic of China.

 Be it enacted by the Senate and House of Representatives of the 
United States of America in Congress assembled,

SECTION 1. SHORT TITLE.

 This Act may be cited as the ``China Advanced Technology Monitoring 
Act''.

SEC. 2. ANNUAL REPORT ON ADVANCED SEMICONDUCTOR MANUFACTURING 
 CAPABILITIES OF CHINA.

    (a) Report.--Not later than May 1, 2026, and annually thereafter 
for 5 years, the Secretary of Defense, in consultation with the heads 
other Federal departments and agencies as appropriate, shall submit to 
the Committees on Armed Services of the House of Representatives and 
the Senate a report on the semiconductor manufacturing capabilities, 
including advanced and mature-node semiconductors, of the People's 
Republic of China.

    (b) Elements.--The report required by subsection

    (a) shall also 
include the following:

    (1) A statement of key findings and assessments with 
 respect to the United States strategy to counter China and 
 specific policy recommendations to Congress regarding China's 
 goal to advance semiconductor manufacturing.

    (2) An assessment of the domestic semiconductor 
 manufacturing capabilities of China.

    (3) A detailed analysis of the industrial policies of China 
 and the outcomes of such policies on such manufacturing 
 capabilities.

    (4) A year-by-year assessment of technological development 
 efforts by China in the fields of semiconductor manufacturing 
 and artificial intelligence chipmaking, including relevant 
 government plans and initiatives, that specifically addresses 
 gains in every aspect of manufacturing, such as design, 
 intellectual property, research and development, silicon and 
 critical minerals, industrial gases, intermediaries such as 
 photomasks, equipment, tools, and software, and advanced 
 packaging techniques.

    (5) A description of engagement between China and other 
 foreign countries with respect to semiconductor manufacturing 
 equipment capabilities, including--
        (A) coordination with other countries and markets 
 to expand semiconductor influence; and
        (B) foreign investment, trade, and research ties 
 and partnerships with other countries.

    (6) An analysis of the extent to which there is 
 collaboration, joint ventures, or partnerships between China 
 and other foreign countries with respect to semiconductor 
 manufacturing.

    (7) An analysis of the impact of United States and allied 
 and partner export controls on covered items related to the 
 development of semiconductor manufacturing in China, 
 specifically with respect to the effectiveness of current 
 United States protections against--
        (A) export control workarounds and loopholes;
        (B) circumvention through foreign investments or 
 third-party acquisitions; and
            (C) risks posed by collaborative agreements, 
 partnerships, supplier relocations, and contractual 
 relationships that may indirectly benefit China.

    (8) An assessment of whether such export controls remain 
 effective in curbing the development of semiconductor 
 manufacturing equipment capabilities in China and 
 recommendations for enhancing effectiveness of such controls.

    (9) An assessment of the implications of Chinese 
 semiconductor manufacturing dominance on--
        (A) United States global competitiveness;
        (B) United States national security and national 
 economic security; and
            (C) the national economy of the United States.
            (c) Form.--The report required by subsection

    (a) shall be submitted 
in unclassified form and shall include a classified annex, providing 
additional details and supporting intelligence, as available. The 
unclassified portion, or an unclassified synopsis, of the report shall 
concurrently be made available on a publicly available website of the 
Federal Government and a notice to that effect shall be concurrently 
published in the Federal Register.
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